Power chips are attached to exterior circuits via product packaging, and their performance depends upon the assistance of the product packaging. In high-power situations, power chips are normally packaged as power components. Chip affiliation refers to the electric link on the upper surface of the chip, which is normally light weight aluminum bonding cable in conventional components. ^
Standard power component plan cross-section
At present, industrial silicon carbide power modules still primarily use the product packaging technology of this wire-bonded standard silicon IGBT module. They face issues such as large high-frequency parasitic parameters, inadequate warm dissipation capability, low-temperature resistance, and not enough insulation strength, which limit the use of silicon carbide semiconductors. The display screen of outstanding efficiency. In order to resolve these troubles and completely manipulate the big possible advantages of silicon carbide chips, several brand-new product packaging innovations and remedies for silicon carbide power modules have actually emerged in recent years.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold cables to copper cables, and the driving force is cost reduction; high-power devices have created from light weight aluminum wires (strips) to Cu Clips, and the driving force is to enhance product efficiency. The greater the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a strong copper bridge soldered to solder to connect chips and pins. Compared to conventional bonding packaging techniques, Cu Clip innovation has the following advantages:
1. The link in between the chip and the pins is made of copper sheets, which, to a particular extent, changes the common wire bonding approach between the chip and the pins. As a result, an unique package resistance worth, greater existing circulation, and better thermal conductivity can be gotten.
2. The lead pin welding location does not need to be silver-plated, which can totally conserve the cost of silver plating and inadequate silver plating.
3. The item appearance is totally regular with typical products and is generally made use of in web servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and various other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding approach
Both the Gate pad and the Resource pad are clip-based. This bonding approach is a lot more costly and complex, however it can achieve much better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cord bonding approach
The source pad makes use of a Clip technique, and the Gate utilizes a Cable approach. This bonding technique is a little less costly than the all-copper bonding method, saving wafer area (appropriate to very small entrance areas). The procedure is easier than the all-copper bonding technique and can acquire far better Rdson and better thermal impact.
Supplier of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding oxidized copper, please feel free to contact us and send an inquiry.
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